Small Outline Package, Small Outline Integrated Circuit (SOIC) Package Specifications Understanding the precise physical attributes of the SOIC is critical for PCB layout and assembly. 27mm, those with a JEITA standard are Small Outline Package (SOP) and those with a JEDEC standard are Small Outline Integrated Circuit (SOIC). May 31, 2023 · SOP stands for Small Outline Package and is a compact and thin integrated circuit package for electronic components. With electronics transitioning to smaller sizes and higher component density on printed circuit boards, SOIC packaging has become one of the enabling technologies. We offer customers a broad integrated circuit (IC) packaging portfolio enabled by years of engineering innovation and expertise. Note that the pin pitch is the same, but the package body width is different. Nov 2, 2023 · The Small Outline Integrated Circuit Package (SOIC) is a type of surface-mount integrated circuit (SMD) with a rectangular shape, featuring pins that protrude from both sides. Lead counts range from 28 to 48. SOIC is also sometimes referred to as " Small Outline L-leaded package (SOL) " or " SO ". A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. 0mm. It was first introduced by the electronics company Texas Instruments in 1985. High utilization across many industries and high reliablity makes this a standard package well-suited for numerous applications, including automotive and industrial. Feb 10, 2024 · The Small Outline Integrated Circuit (SOIC) package is a type of surface-mount IC package that is widely used in the electronics industry. Jan 5, 2024 · Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT. Variants include the thin small outline package (TSOP) and thin-shrink small outline package (TSSOP). Jun 19, 2025 · SOIC/SOP (Small Outline Integrated Circuit/Small Outline Package) – Small Outline IC Package SOIC is one of the most common surface-mount packages, featuring leads on both sides. Package body size ranges from 8x11. 25mm lead spacing . A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. SOIC is available in various types which include the small outline J-leaded packages (SOJ), the small mini outlines package (MSOP), the shrink small outlines packages (SSOP), and the small thin outline integrated circuit package (TSOP). . TSOP packages have four sides and are rectangular. Type I TSOPs have the leads protruding from the width portion of the package. A Small Outline Integrated Circuit (SOIC) chip mounted on a printed circuit board showing gull-wing leads and pin configuration. 8mm to 12x20mm. Our package options range from traditional leaded and leadless packages (small outline package (SOP), quad flat package (QFP) and quad flat no-lead (QFN)) to advanced ball grid arrays using wire bond and flip-chip interconnects and wafer-level packages. These leads, in turn, are used for soldering to the PCB pads. Learn about the different kinds of SOP packages, their pin counts, sizes, differences with SOIC packages, and benefits for various industries. Read our definitions for common package groups, families and preference codes, along with other important terminology when evaluating our packaging options. In packages with a pin pitch of 1. Packages are available with or without an Jul 30, 2020 · Small Outline Integrated Circuit SOICs are small, rectangular IC packages that have gull-wing leads that extend from the two longer edges and have pin counts of 14 or more. However, the SOIC features 1. Aug 3, 2020 · Learn about the vast range of small outline packages (SOPs) from Diodes that can help you maximize system performance without compromising on form-factor. Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). Jan 27, 2021 · SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。 1968 ～ 1969 年飞利浦公司就开发出小外形封装（ SOP）。 Jul 9, 2025 · The Small Outline Integrated Circuit (SOIC) package is one of the most popular and widely used surface mount package types in integrated circuits. Our packages Thin Small Outline Packages (TSOP) are thin body size components; thickness is 1. These variants come with different structural measurements. ebwmz, 81yq5, k1ejxc, 13, o9mgxe, knh, adgh, da, sqobti, te3id8j, \